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Simulation of Complex Heat Transfer Phenomenon across the Composite Wall by Using COMSOL Multiphysics

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dc.contributor.author Bashir, Muhammad Sohail
dc.contributor.author Safdar, Aqsa
dc.date.accessioned 2019-10-25T10:15:03Z
dc.date.available 2019-10-25T10:15:03Z
dc.date.issued 2017-12-01
dc.identifier.uri http://142.54.178.187:9060/xmlui/handle/123456789/726
dc.description.abstract Steady state complex heat transfer phenomenon across a cold storage composite wall has been studied by using COMSOL 5.0 Multiphysics simulation software. The layers of composite wall are built with three different materials, pine, cork board and concrete. Inside and outside surface temperatures of composite wall are T1 = 255K and T4 = 298 K respectively. Without including convective resistance heat flux value is 17.15 W/m2 and with convective resistance it is reduced to 12.12 W/m2. The temperature profiles in each composite layer are linear at constant thermal conductivities. But it has been observed that this trend is changed when thermal conductivities are the function of temperature. COMSOL Multiphysics simulator results are compared with analytical results. en_US
dc.language.iso en_US en_US
dc.publisher Pakistan Journal of Engineering Technology and Science en_US
dc.subject Composite Wall en_US
dc.subject COMSOL en_US
dc.subject Heat Flux en_US
dc.subject Temperature Profile en_US
dc.subject.ddc Engineering and Technology
dc.title Simulation of Complex Heat Transfer Phenomenon across the Composite Wall by Using COMSOL Multiphysics en_US
dc.type Article en_US


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